CASTING & COMPOSITES
CASTING & COMPOSITES > Encapsulation – Potting
Encapsulation – Potting
DescriptionPolyaddition silicone gel, two-component, colorless transparent even at high thicknesses, low viscosity and very high resistance to yellowing. High flexibility, available in different degrees of compactness.
Main applicationsIdeal for lining, insulating and protecting electrical contacts in printed circuit boards and junction boxes from water, humidity, contaminants, thermal shock and vibration. Easilyremovable after drying.
GLOBALPOT G LED
DescriptionPolyaddition silicone with low viscosity and easy to use. Colorless transparent with very high resistance to yellowing even at high thicknesses. Possibility of coloring on request. Fair mechanical properties.Hardness of 25shoreA.
Main applicationsDesigned for the lighting sector for the encapsulation of electronic components especially where a high degree of transparency is required such as LED bars.
DescriptionHard and semi-flexible two-component resin characterized by very high mechanical and chemical resistance. It lends itself to applications that require high execution speed.
Main applicationsSuitable where the circuit to be filled contains delicate components thanks to its elastomeric properties which reduce the charge applied to the components. Excellent electrical insulation, adhesion to both metal and plastic substrates.
DescriptionSlow curing epoxy resin with long workability time, low exothermic peak and low viscosity. High transparency.
Main applicationsIdeal for encapsulating, insulating and protecting electrical contacts in printed circuit boards and junction boxes.
Solutions for consolidation and waterproofing inside tunnels and mines, consumables for mechanized excavation by TBM (Tunnel Boring Machine) and MTBM (Micro-tunnel boring machine), HDD systems (Horizontal Directional Drilling).More